| TPro 100: | Conventional MCPCB with an epoxy pre-preg as the dielectric layer. |
| TPro 120: | MCPCB with a thin dielectric epoxy film, most suitable for extremely low voltage and high heat dissipation applications. |
| TPro 180: | A variation of TPro 120 by a proprietary printing/coating processes, most suitable for simple PCB layout applications. |
TPro 100s MCPCB Specs Sheet
ITEM |
Unit/ Method |
TPro 100 |
TPro 120 |
TPro 180 |
|
|
Subtract |
Material |
|
AL 5xxx/6xxx |
AL 5xxx/6xxx |
AL 5xxx/6xxx |
|
Thickness |
mm |
1-2 |
1-2 |
1-2 |
|
|
Dielectric material layer |
Insulation thickness |
mm |
0.10, 0.15 |
0.05~ 0.10 |
0.08 ~0.12 |
|
Breakdown voltage |
kV (D149-97a) |
2 ~ 3 |
1.0 ~ 1.5 |
1.2 ~ 2.5 |
|
|
Thermal conductivity |
W/m-k |
0.8 ~ 1.2 |
> 3 |
> 2 |
|
|
Thermal resistance |
(Relativity) |
High |
Lowest |
Low |
|
|
Conductivity layer |
Thickness |
μm |
35 |
35 |
35 |
|
Peel strength |
kgf /cm2 |
> 2 |
> 2 |
> 2 |
|
|
Surface resistance |
Ω．cm |
< 0.1 |
< 0.1 |
< 0.1 |
|
|
Operation condition (Max) |
℃ x Sec. |
280x10 |
280x10 |
280x10 |
|
|
Product |
Thickness |
cm |
1.1 ~ 2.2 |
1.1 ~ 2.2 |
1.1 ~ 2.2 |
|
Peel strength (solder mask) |
kgf /cm2 |
> 3 |
> 3 |
> 3 |
|
|
Breakdown voltage (solder mask) |
kV (D149-97a) |
2 ~ 3 |
1.0 ~ 2.5 |
1.2 ~ 2.5 |
|
|
Operation Temp. |
℃ |
-40 ~ 150 |
-40 ~ 150 |
-40 ~ 150 |
|